電子封裝材料 鎢銅 鉬銅 金剛石/銅復(fù)合材料 WCu and MoCu Electric Materials
?鉬銅合金性能 Typical Properties of MoCu Alloys
材料 Material | Cu含量(%wt) Copper Content | 密度(g/cm3) Density
| 熱導(dǎo)率(W/m.K-1) Thermal Conductivity | 熱膨脹系數(shù)(10-6/℃,25) CTE at 25℃
|
Mo85Cu15 | 15±2 | ≧10 | 170±15 | 7.0 |
Mo80Cu20 | 20±2 | ≧9.9 | 180±15 | 7.8 |
Mo75Cu25 | 25±2 | ≧9.8 | 190±15 | 8.7 |
Mo70Cu30 | 30±2 | ≧9.7 | 200±15 | 9.2 |
?產(chǎn)品類型 Product
板 棒 片材 異型加工制品 Plate,Rod, Manufactured parts
?應(yīng)用領(lǐng)域 Appliction
IC芯片封裝 heatsink of IC chip
功率半導(dǎo)體器件熱沉 high power chip heat management
半導(dǎo)體引線框架lead frame of intigreted circuit
電力開關(guān)行業(yè)用觸頭 electric contact of electricity industry